Samsung‘s 7th generation foldable lineup will include the Galaxy Z Fold 7, Flip 7, and Flip 7 FE, and a new tri-fold device — and according to the latest leak, the fan edition flip phone might actually pack a superior chipset compared to the regular Flip 7.
The chipset rumors around the upcoming Galaxy flagships (both the 7th-gen foldables and the S26 series) have been a rollercoaster. While Samsung has always powered its foldables with Snapdragon chips, the delayed development of the Exynos 2500 series suggests it may finally make its way into the foldables — at least the Z Flip 7. The latest leak reaffirms this speculation. However, the new FE model is rumored to be a “lazy rebrand” of the Z Flip 6, which means it’ll likely include the Snapdragon 8 Gen 3.
There have been consistent yield and performance issues holding back the Exynos 2500. And while most Exynos chips over the last 5–6 years have launched with promises of better efficiency and stability, those expectations have rarely been met. So, if history is any indication — especially with the known production issues on Samsung’s 3nm node — it’s best not to keep high hopes for a device powered by this new chip.
The Snapdragon 8 Gen 3, on the other hand, is a proven chipset and is expected to be more stable and power-efficient, even if it doesn’t quite match the Exynos 2500 in peak performance.
The Galaxy Z Fold 7 is expected to feature the Snapdragon 8 Elite, which further suggests that the Exynos 2500 may not yet be ready to handle heavy workloads. The lineup is expected to launch in early July, and more details should surface as we get closer to the launch.
Tech enthusiast? Get the latest news first! Follow our Telegram channel and subscribe to our free newsletter for your daily tech fix!
For more daily updates, please visit our News Section.
(Source)
Comments